MPI OSPRAY PROBE CARDS

MPi Ospray Probe Cards

MPi Ospray Probe Cards

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Canteliver Probe Card

MPI Cantilever Probe Card is widely applied on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes will be the corresponding remedy towards the needs of fi­ne pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, higher pin count, and ultra-reduced leakage demands. With remarkable craftsmanship, revolutionary architecture and verified methodologies based upon mechanical and electrical simulation/measurement success, making MPI the top cantilever provider globally.


FCB Probe Card

The FCB Probe Card is among the most mature technologies of buckling beam probe card. It really is aimed to realize the semiconductor ship manufacture time-to-market place (TTM) and value of check (COT) need. FCB is really a confirmed Answer for many different semiconductor manufacturing tests from early engineering pilot-operates to significant quantity manufacturing (HVM). FCB is prepared for machine demanding high sign integrity probing (SI) and/or electricity integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the world’s most effective Over-all Expense-of-ownership (COO) for several DUT programs.


EVS Probe Card

The EVS Probe Card is an improvement above the standard buckling beam probe card. Essential attributes are bigger recent carrying capacity (C.C.C.) and decreased balanced Call power (BCF), and Total MEMS-like traits. EVS can certainly meet the necessity of advanced wafer probing. Exact alignment and fantastic planarity Handle are the crucial things contributing to stable Speak to resistance. With its potential and efficiency, EVS Probe Card is a really perfect choice for Superior probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s solution to need for ever finer pitch. It can be designed for smaller sized Al pad, which is perfect for very small pitch application with peripheral and total array pattern. With exact alignment and improved planarity Manage, Osprey can get to better efficiency by multi-DUT design.  The forming wire (FW) sort needle developed with MPI’s individual micro fabrication system not only delivers high-top quality functionality and also lets quick needle substitution and shortens protecting cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of small drive probing. In addition it comes along with the opportunity to satisfy large C.C.C. and large pin counts application. The MEMS process ensures really dependable needle features, plus the Specific construction style permits exact alignment and planarity Handle.


MPI probe card division provides a read more wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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